VLSI Interconnects
Created By
Prof. Sarang Pendharker via Swayam
- 0
- 8 weeks long
- Swayam
- English
Course Overview
ABOUT THE COURSE:Interconnects are the wired connections between various devices and components in an integrated circuit. As the clock frequency and operating frequency of the electronic devices is increasing, going up to several GHz, the effects of these wired connection cannot be ignored anymore. In fact, the interconnect effects which include delays, timing jitters and cross-talk are expected to become bottleneck in further increase in the speed of electronic circuits. In this course we will investigate origin of several interconnect effects and explore techniques for electromagnetic and circuit modeling of these interconnect effects. The course is of importance for anyone interested in the high frequency circuit design and signal integrity issues in electronics and telecommunication industries.INTENDED AUDIENCE:Senior UG, P.G., Ph.D in Dept. of ECE, EE.PREREQUISITES:U.G. level course in electromagnetics or micorwave engineering or EM Waves.INDUSTRY SUPPORT:Micron Technologies: Signal Integrity profile. Qualcomm: Interconnect profile; Signal integrity profile. Intel Corp.: Signal integrity profile.
Course Circullum
Week 1: Introduction to VLSI Interconnects. Distributed RC interconnect model, Elmore delay, Elmore delay in interconnects, Elmore delay in RC tree and branched interconnectsWeek 2:Equivalent circuit of RC interconnect, Scaling Effects, Delay mitigation in RC interconnects, RC interconnect simulation session, Inductive effects in interconnectsWeek 3:Distributed RLC Interconnect model (Frequency domain analysis), Transmission line equations. When to consider the inductive effects?, The transfer function of an interconnect, Time-domain response of a lumped model RLC circuitWeek 4:Equivalent Elmore model for RLC interconnects (Distributed model), Two-pole model of RLC interconnects from ABCD parameters.Simulation of RLC interconnects.Origin of the skin effect, Effective resistance at high frequenciesWeek 5:Equivalent circuit to simulate skin effect, Power dissipation due to interconnects, Optimum interconnect width for minimizing total power dissipation. Heating effects and thermal modelling, Compact Thermal modeling with equivalent electrical circuit.Week 6:Electromigration in interconnects, Mitigation of electromigration. Capacitive coupling in interconnects. Cross-talk and timing jitters in two identical interconnects. Effects of cross-talk and timing jitters. Week 7:Techniques for mitigation of cross-talk. ??Lecture-32: Matrix formulation of coupled interconnects. Coupled RLC interconnects, Decoupling of interconnects by diagonalization of matrix , Analysis of coupled interconnects: ExamplesWeek 8:Analysis of coupled interconnects: Examples-2, Simulation of RC coupled interconnects, Extraction of capacitance (part-1), Extraction of capacitance (part-2), Extraction of inductance (part-1), Estimation of interconnect parameters from S parameters.
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This Course Include:
Week 1: Introduction to VLSI Interconnects. Distributed RC interconnect model, Elmore delay, Elmore delay in interconnects, Elmore delay in RC tree and branched interconnectsWeek 2:Equivalent circuit of RC interconnect, Scaling Effects, Delay mitigation in RC interconnects, RC interconnect simulation session, Inductive effects in interconnectsWeek 3:Distributed RLC Interconnect model (Frequency domain analysis), Transmission line equations. When to consider the inductive effects?, The transfer function of an interconnect, Time-domain response of a lumped model RLC circuitWeek 4:Equivalent Elmore model for RLC interconnects (Distributed model), Two-pole model of RLC interconnects from ABCD parameters.Simulation of RLC interconnects.Origin of the skin effect, Effective resistance at high frequenciesWeek 5:Equivalent circuit to simulate skin effect, Power dissipation due to interconnects, Optimum interconnect width for minimizing total power dissipation. Heating effects and thermal modelling, Compact Thermal modeling with equivalent electrical circuit.Week 6:Electromigration in interconnects, Mitigation of electromigration. Capacitive coupling in interconnects. Cross-talk and timing jitters in two identical interconnects. Effects of cross-talk and timing jitters. Week 7:Techniques for mitigation of cross-talk. ??Lecture-32: Matrix formulation of coupled interconnects. Coupled RLC interconnects, Decoupling of interconnects by diagonalization of matrix , Analysis of coupled interconnects: ExamplesWeek 8:Analysis of coupled interconnects: Examples-2, Simulation of RC coupled interconnects, Extraction of capacitance (part-1), Extraction of capacitance (part-2), Extraction of inductance (part-1), Estimation of interconnect parameters from S parameters.
- Provider:Swayam
- Certificate:Paid Certificate Available
- Language:English
- Duration:8 weeks long
- Language CC: